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c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 a n p e c r e s e r v e s t h e r i g h t t o m a k e c h a n g e s t o i m p r o v e r e l i a b i l i t y o r m a n u f a c t u r a b i l i t y w i t h o u t n o t i c e , a n d a d v i s e c u s t o m e r s t o o b t a i n t h e l a t e s t v e r s i o n o f r e l e v a n t i n f o r m a t i o n t o v e r i f y b e f o r e p l a c i n g o r d e r s . 2 a h i g h s i d e l o a d s w i t c h e s 70m w high side mosfet w i d e s u p p l y v o l t a g e r a n g e : 2 . 7 v t o 5 . 5 v current-limit and short-circuit protections over-temperature protection fault indication output logic level enable pin lead free and green devices available (rohs compliant) the APL3513 is a power-distribution switch with some protection that can deliver current up to 2a. the device incorporates a 70m w n-channel mosfet power switch that is controlled by an enable logic pin. f e a t u r e s g e n e r a l d e s c r i p t i o n a p p l i c a t i o n s cellular telephones digital still cameras hot swap supplies notebook computers personal communication devices personal digital assistants (pdas) p i n c o n f i g u r a t i o n the protection features include current-limit protection, short-circuit protection, and over-temperature protection. the device limits the output current at current limit thresh- old level. when v out drops below v in -1v, the devices limit the current to a lower and safer level. the over-tempera- ture protection limits the junction temperature below 140 o c in case of short circuit or over load conditions. s i m p l i f i e d a p p l i c a t i o n c i r c u i t vin vout gnd APL3513 en 5v en v out = exposed pad (connected to ground plane for better heat dissipation) tdfn2x2-8(top view) APL3513 7 vin 5 vin 6 vin 8 vin gnd 4 vout 2 vin 1 en 3
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 2 o r d e r i n g a n d m a r k i n g i n f o r m a t i o n n o t e : a n p e c l e a d - f r e e p r o d u c t s c o n t a i n m o l d i n g c o m p o u n d s / d i e a t t a c h m a t e r i a l s a n d 1 0 0 % m a t t e t i n p l a t e t e r m i n a t i o n f i n i s h ; w h i c h a r e f u l l y c o m p l i a n t w i t h r o h s . a n p e c l e a d - f r e e p r o d u c t s m e e t o r e x c e e d t h e l e a d - f r e e r e q u i r e m e n t s o f i p c / j e d e c j - s t d - 0 2 0 d f o r m s l c l a s s i f i c a t i o n a t l e a d - f r e e p e a k r e f l o w t e m p e r a t u r e . a n p e c d e f i n e s ? g r e e n ? t o m e a n l e a d - f r e e ( r o h s c o m p l i a n t ) a n d h a l o g e n f r e e ( b r o r c l d o e s n o t e x c e e d 9 0 0 p p m b y w e i g h t i n h o m o g e n e o u s m a t e r i a l a n d t o t a l o f b r a n d c l d o e s n o t e x c e e d 1 5 0 0 p p m b y w e i g h t ) . a b s o l u t e m a x i m u m r a t i n g s ( n o t e 1 ) symbol parameter rating unit v in vin input voltage (vi n to gnd ) - 0.3 ~ 7 v v out vout to gnd voltage - 0.3 ~ 7 v v enb , v en en, enb to gnd voltage - 0.3 ~ 7 v t j maximum junction temperature 150 o c t stg storage temperature - 65 ~ 150 o c t sdr maximum lead soldering temperature , 10 seconds 26 0 o c note 1: absolute maximum ratings are those values beyond which the life of a device may be impaired. exposure to absolute maximum rating conditions for extended periods may affect device reliability. t h e r m a l c h a r a c t e r i s t i c s symbol parameter typical value unit q ja junction - to - ambient resistance in free air (note 2) tdfn2x2 - 8 80 o c/w note 2 : q ja is measured with the component mounted on a high effective thermal conductivity test board in free air. the exposed pad of tdfn2x2-8 is soldered directly on the pcb. APL3513 package code qb : tdfn2x2-8 operating ambient temperature range i : -40 to 85 o c handling code tr : tape & reel assembly material g : halogen and lead free device handling code temperature range package code apl 3513 qb: l13 x x - date code assembly material symbol parameter range unit v in vin input voltage 2.7 ~ 5.5 v i out out output current 0 ~ 2 a t a ambient temperature - 40 ~ 85 o c t j junction temperature - 40 ~ 125 o c r e c o m m e n d e d o p e r a t i n g c o n d i t i o n s ( n o t e 3 ) note 3 : refer to the typical application circuit
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 3 e l e c t r i c a l c h a r a c t e r i s t i c s unless otherwise specified, these specifications apply over v in =5v, v en =5v or v enb =0v and t a = -40 ~ 85 o c. typical values are at t a =25 o c. apl3 513 symbol parameter test conditions min . typ . max . unit supply current no load, v en =0v - - 1 m a vin supply current no load, v en =5v - 65 100 m a leakage current vout=gnd, v en =0v - - 1 m a reverse leakage current vin=gnd, v out =5v, v en =0v - - 1 m a power switch r ds(on) power switch on resistance i out =1.5a, t a = 2 5 o c - 70 90 m w under - voltage lockout (uvlo) vin uvlo threshold voltage v in rising, t a = - 40 ~ 85 o c 2.3 - 2.65 v vin uvlo hysteresis - 0.2 - v current - limit and short - circuit protections i lim current limit threshold v in = 2.7 v to 5.5v, t a = - 40 ~ 85 o c 2.1 2.5 3.6 a i short short - circuit output current v in = 2.7 v to 5.5v - 0.8 - a en input pin v ih input logic high v in = 2.7 v to 5v 2 - - v v il input logic low v in = 2.7 v to 5v - - 0. 8 v input current - - 1 m a vout discharge resistance v en =0v - 150 - w t d(on) turn on delay time - 30 - m s t d(off) turn off delay time - 30 - m s t ss soft - start time no load, c out =1 m f, v in = 5 v - 400 - m s over - temperature protection (otp) t otp ove r - temperature threshold t j rising - 140 - c over - temperature hysteresis - 20 - c
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 4 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s s w i t c h o n r e s i s t a n c e , r d s ( o n ) ( m w ) switch on resistance vs. junction temperature junction temperature ( o c) v in =5v, i out =1.5a , c in =1 m f/x7r, c out =10 m f/x7r, 40 60 80 100 120 140 160 20 0 -50 0 50 100 150 switch on resistance vs. input voltage s w i t c h o n r e s i s t a n c e , r d s ( o n ) ( m w ) input voltage (v) i out =1.5a, c in =1 m f/x7r, c out =10 m f/x7r, t a =25 o c 2.5 3.0 3.5 4.0 4.5 5.0 5.5 60 80 90 100 110 120 130 70 50 supply current vs. junction temperature s u p p l y c u r r e n t , i c c ( m a ) junction temperature ( o c) v in =5v, r load = open, c in =c out =33 m f/ electrolytic -50 0 50 100 150 0 20 40 60 80 100 supply current vs. input voltage input voltage (v) s u p p l y c u r r e n t , i c c ( m a ) 20 25 30 35 40 45 50 55 60 r load = open, c in =c out =33 m f/ electrolytic, t a j =25 2.5 3.0 3.5 4.0 4.5 5.0 5.5 current limit threshold vs. junction temperature c u r r e n t l i m i t t h r e s h o l d , i l i m ( a ) junction temperature ( o c) v in =5v -50 0 50 100 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 input voltage (v) c u r r e n t l i m i t t h r e s h o l d , i l i m ( a ) current limit threshold vs. input voltage t a =25 o c 2.5 3.0 3.5 4.0 4.5 5.0 5.5 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 5 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) output peak current (a) c u r r e n t - l i m i t r e s p o n s e ( m s ) current-limit response vs. output peak current v in = 5v, t a =25 o c 0 2 4 6 8 10 12 0 50 100 150 200 250 300 short-circuit output current vs. input voltage input voltage (v) s h o r t - c i r c u i t o u t p u t c u r r e n t , i s h o r t ( a ) t a =25 o c 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 2.5 3.0 3.5 4.0 4.5 5.0 5.5 en pin threshold voltage vs. junction temperature e n p i n t h r e s h o l d v o l t a g e , v e n ( v ) junction temperature ( o c) en rising en falling r load =50 w , c in = c out =33 m f/elctrolytic -50 0 50 100 150 0.5 1.0 1.5 2.0 2.5 3.0 en pin threshold voltage vs. input voltage input voltage (v) e n p i n t h r e s h o l d v o l t a g e , v e n ( v ) en rising en falling v in =5v, r load =50 w , c in = c out =33 m f/elctrolytic, t a =25 o c 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0.8 0.9 1.0 1.1 1.2 2.5 3.0 3.5 4.0 4.5 5.0 5.5 uvlo threshold voltage vs. junction temperature u v l o t h r e s h o l d v o l t a g e , v v l o c ( v ) uvlo rising uvlo falling v in increasing, i out =15ma, c in = c out =33 m f/elctrolytic junction temperature ( o c) -50 0 50 100 150 1.2 1.6 2.0 2.4 2.8 3.2 0.8 turn-off leakage current vs. junction temperature t u r n - o f f l e a k a g e c u r r e n t , i l e a k ( m a ) junction temperature ( o c) v in =5v, r load =0 w , c in = c out =33 m f/elctrolytic 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 -50 0 50 100 150
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 6 t y p i c a l o p e r a t i n g c h a r a c t e r i s t i c s ( c o n t . ) t u r n - o n r i s i n g t i m e , t r ( m s ) turn-on rising time vs. junction temperature junction temperature ( o c) v in = 5v, r load =30 w , c in = 33 m f/elctrolytic, c out =1 m f/x7r -50 0 50 100 150 0 100 200 600 700 300 400 500 switch off supply current vs. junction temperature s w i t c h o f f s u p p l y c u r r e n t , i c c ( o f f ) ( m a ) junction temperature ( o c) v in = 5v, r load = open , c in = c out =33 m f/elctrolytic -50 0 50 100 150 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 output voltage vs. output current 0 1 2 3 4 5 6 o u t p u t v o l t a g e , v o u t ( v ) output current (a) v in = 5v, t a =25 j 0.0 0.5 1.0 1.5 2.0 2.5 3.0 turn-off falling time vs. junction temperature t u r n - o f f f a l l i n g t i m e , t f ( m s ) v in = 5v, r load =30 w , c in = 33 m f/elctrolytic, c out =1 m f/x7r junction temperature ( o c) -50 0 50 100 150 100 150 200 50 0
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 7 o p e r a t i n g w a v e f o r m s t h e t e s t c o n d i t i o n i s v i n = 5 v , t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . t u r n o n r e s p o n s e ch1: v en , 5v/div, dc time: 100 m s/div v in =5v, r load =30 w , c in =1 m f/electrolytic, c out =0.1 m f/electrolytic ch2: v out , 2v/div, dc t u r n o f f r e s p o n s e p o w e r o n p o w e r o f f time:5m s/div v in =5v, r load =30 w , c in =1 m f/electrolytic, c out =0.1 m f/electrolytic ch1: v in , 2v/div, dc ch2: v out , 2v/div, dc time: 10 m s/div v in =5v, r load =30 w , c in =1 m f/electrolytic, c out =0.1 m f/electrolytic ch2: v out , 2v/div, dc ch1: v en , 5v/div, dc time:10m s/div ch2: v out , 2v/div, dc v in =5v, r load =30 w , c in =1 m f/electrolytic, c out =0.1 m f/electrolytic ch1: v in , 2v/div, dc 1 2 v en v out 1 2 v en v out 1 2 v out v in 1 2 v in v out
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 8 o p e r a t i n g w a v e f o r m s ( c o n t . ) t h e t e s t c o n d i t i o n i s v i n = 5 v , t a = 2 5 o c u n l e s s o t h e r w i s e s p e c i f i e d . o v e r l o a d r e s p o n s e ch1: v in , 2v/div, dc ch2: v out , 2v/div, dc time: 1 m s/div v in =5v, c in =1 m f/electrolytic, c out =0.1 m f/ electrolytic ch3: i out , 1a/div, dc 1 2 3 v out v in i out p i n d e s c r i p t i o n pin no. name function 1,5,6,7,8 vin power supply input. c onnect this pin to external dc supply. 2 vout output voltage pin. the output voltage follows the input voltage. when enb is high or en is low, the output voltage is discharged by an internal res istor. 3 en enable control input. pulling this pin to high will enable the device and pulling this pin to low will disable device. the en pin cannot be left floating. 4 gnd ground .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 9 b l o c k d i a g r a m gate driver and control logic uvlo vin vout charge pump en otp gnd current limit short-circuit protection t y p i c a l a p p l i c a t i o n c i r c u i t vin vout gnd APL3513 en 5v c in 1 m f c byp 0.1 m f v out
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 0 f u n c t i o n d e s c r i p t i o n vin under-voltage lockout (uvlo) the APL3513 series of power switches have a built-in under-voltage lockout circuit to keep the output shutting off until internal circuitry is operating properly. the uvlo circuit has hysteresis and a de-glitch feature so that it will typically ignore undershoot transients on the input. when input voltage exceeds the uvlo threshold, the output voltage starts a soft-start to reduce the inrush current. power switch the power switch is an n-channel mosfet with a low r ds(on) . the internal power mosfet does not have the body diode. when ic is off, the mosfet prevents a cur- rent flowing from the vout back to vin and vin to vout. current-limit protection the APL3513 series of power switches provide the cur- rent-limit protection function. during current limit, the de- vices limit output current at current limit threshold. for reliable operation, the device should not be operated in current limit for extended period. short-circuit protection when the output voltage drops below v in -1v, which is caused by an over-load or a short-circuit, the devices limit the output current down to a safe level. the short-circuit current limit is used to reduce the power dissipation dur- ing short-circuit conditions. if the junction temperature reaches over-temperature threshold, the device will en- ter the thermal shutdown. enable/disable pull the en below 0.8v will disable the device, and en above 2v will enable the device. when the ic is disabled, the supply current is reduced to less than 1 m a. the en- able input is compatible with both ttl and cmos logic levels. the en pin cannot be left floating. over-temperature protection when the junction temperature exceeds 140 o c, the inter- nal thermal sense circuit turns off the power fet and allows the device to cool down. when the device?s junc- tion temperature cools by 20 o c, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. thermal protection is designed to protect the ic in the event of over temperature conditions. for normal operation, the junction temperature cannot exceed t j =+125 o c.
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 1 a p p l i c a t i o n i n f o r m a t i o n i n p u t c a p a c i t o r a 1 m f c e r a m i c b y p a s s c a p a c i t o r f r o m v i n t o g n d , l o c a t e d n e a r t h e a p l 3 5 1 3 , i s s t r o n g l y r e c o m m e n d e d t o s u p p r e s s t h e r i n g i n g d u r i n g s h o r t c i r c u i t f a u l t e v e n t . w i t h o u t t h e b y p a s s c a p a c i t o r , t h e o u t p u t s h o r t m a y c a u s e s u f f i c i e n t r i n g i n g o n t h e i n p u t ( f r o m s u p p l y l e a d i n d u c t a n c e ) t o d a m - a g e i n t e r n a l c o n t r o l c i r c u i t r y . o u t p u t c a p a c i t o r a b y p a s s i n g 0 . 1 m f c e r a m i c c a p a c i t o r i m p r o v e s t h e i m m u - n i t y o f t h e d e v i c e t o s h o r t - c i r c u i t t r a n s i e n t s . a l o w - e s r h i g h c a p a c i t a n c e b e t w e e n v o u t a n d g n d i s s u g g e s t e d t o r e d u c e t h e v o l t a g e d r o o p d u r i n g l o a d t r a n s i e n t . layout consideration t h e p c b l a y o u t s h o u l d b e c a r e f u l l y p e r f o r m e d t o m a x i - m i z e t h e r m a l d i s s i p a t i o n a n d t o m i n i m i z e v o l t a g e d r o p , d r o o p a n d e m i . t h e f o l l o w i n g g u i d e l i n e s m u s t b e c o n s i d e r e d : 1 . p l e a s e p l a c e t h e i n p u t c a p a c i t o r s n e a r t h e v i n p i n a s c l o s e a s p o s s i b l e . 2 . o u t p u t d e c o u p l i n g c a p a c i t o r s f o r l o a d m u s t b e p l a c e d n e a r t h e l o a d a s c l o s e a s p o s s i b l e f o r d e c o u p l i n g h i g h - f r e q u e n c y r i p p l e s . 3 . l o c a t e a p l 3 5 1 3 a n d o u t p u t c a p a c i t o r s n e a r t h e l o a d t o r e d u c e p a r a s i t i c r e s i s t a n c e a n d i n d u c t a n c e f o r e x c e l - l e n t l o a d t r a n s i e n t p e r f o r m a n c e . 4 . t h e n e g a t i v e p i n s o f t h e i n p u t a n d o u t p u t c a p a c i t o r s a n d t h e g n d p i n m u s t b e c o n n e c t e d t o t h e g r o u n d p l a n e o f t h e l o a d . 5 . k e e p v i n a n d v o u t t r a c e s a s w i d e a n d s h o r t a s p o s s i b l e .
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 2 p a c k a g e i n f o r m a t i o n t d f n 2 x 2 - 8 d e a b a1 a3 d2 e 2 l e pin 1 corner min. max. 0.80 0.00 0.18 0.30 1.00 1.60 0.05 0.60 a a1 b d d2 e e2 e l millimeters a3 0.20 ref tdfn2x2-8 0.30 0.45 1.00 0.008 ref min. max. inches 0.031 0.000 0.007 0.012 0.039 0.063 0.024 0.012 0.018 0.70 0.039 0.028 0.002 0.50 bsc 0.020 bsc s y m b o l 1.90 2.10 0.075 0.083 1.90 2.10 0.075 0.083
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 3 c a r r i e r t a p e & r e e l d i m e n s i o n s a e 1 a b w f t p0 od0 b a0 p2 k0 b 0 section b-b section a-a od1 p1 h t1 a d application a h t1 c d d w e1 f 178.0 ? 2.00 50 min. 8.4+2.00 - 0.00 13.0+0.50 - 0.20 1.5 min. 20.2 min. 8.0 ? 0.20 1.75 ? 0.10 3.50 ? 0.05 p 0 p1 p 2 d 0 d1 t a 0 b 0 k 0 tdfn2x2 - 8 4.0 ? 0.10 4.0 ? 0.10 2.0 ? 0.05 1.5+0.10 - 0.00 1.5 min. 0.6+0.00 - 0.4 3.35 min 3.35 min 1.30 ? 0.20 (mm) d e v i c e s p e r u n i t package type unit quantity tdfn2x2 - 8 tape & reel 3000
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 4 t a p i n g d i r e c t i o n i n f o r m a t i o n t d f n 2 x 2 - 8 c l a s s i f i c a t i o n p r o f i l e user direction of feed
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 5 c l a s s i f i c a t i o n r e f l o w p r o f i l e s profile feature sn - pb eutectic assembly pb - free assembly preheat & soak temperature min (t smin ) temperature max (t smax ) time (t smin to t smax ) ( t s ) 100 c 150 c 60 - 120 seconds 150 c 200 c 60 - 1 2 0 seconds average ramp - up rate (t smax to t p ) 3 c/second ma x. 3 c/second max. liquidous temperature ( t l ) time at l iquidous (t l ) 183 c 60 - 150 seconds 217 c 60 - 150 seconds peak package body temperature (t p ) * see classification temp in table 1 see classification temp in table 2 time (t p ) ** within 5 c of the spec ified c lassification t emperature ( t c ) 2 0 ** seconds 3 0 ** seconds average r amp - down rate (t p to t smax ) 6 c/second max. 6 c/second max. time 25 c to p eak t emperature 6 minutes max. 8 minutes max. * tolerance for peak profile temperature (t p ) is defined a s a supplier minimum and a user maximum. ** tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. table 2. pb - free process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 350 - 2000 volume mm 3 >2000 <1.6 mm 260 c 260 c 260 c 1.6 mm ? 2.5 mm 260 c 250 c 245 c 3 2.5 mm 250 c 245 c 245 c table 1. snpb eutectic process ? classification temperatures (tc) package thickness volume mm 3 <350 volume mm 3 3 350 <2.5 mm 235 c 22 0 c 3 2.5 mm 220 c 220 c test item method description solderability jesd - 22, b102 5 sec, 245 c holt jesd - 22, a108 1000 hrs, bias @ t j =125 c pct jesd - 22, a102 168 hrs, 100 % rh, 2atm , 121 c tct jesd - 22, a104 500 cycles, - 65 c~150 c hbm mil - std - 883 - 3015.7 vhbm ? 2kv mm jesd - 22, a1 15 vmm ? 200v latch - up jesd 78 10ms, 1 tr ? 100ma r e l i a b i l i t y t e s t p r o g r a m
c o p y r i g h t ? a n p e c e l e c t r o n i c s c o r p . r e v . a . 2 - m a y . , 2 0 1 0 a p l 3 5 1 3 w w w . a n p e c . c o m . t w 1 6 c u s t o m e r s e r v i c e a n p e c e l e c t r o n i c s c o r p . head office : no.6, dusing 1st road, sbip, hsin-chu, taiwan, r.o.c. tel : 886-3-5642000 fax : 886-3-5642050 t a i p e i b r a n c h : 2 f , n o . 1 1 , l a n e 2 1 8 , s e c 2 j h o n g s i n g r d . , s i n d i a n c i t y , t a i p e i c o u n t y 2 3 1 4 6 , t a i w a n t e l : 8 8 6 - 2 - 2 9 1 0 - 3 8 3 8 f a x : 8 8 6 - 2 - 2 9 1 7 - 3 8 3 8

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